High tensile 3.5D series
Applications
Mobile phone composite cover, decorative parts, tablet computer, 3C and peripheral shell applications
Product Features: The 3.5D composite board has a high tensile structure, which better matches the front shell and the 3D curved screen to maximize the utilization rate of each other; it has the IP68 waterproof level defined in IEC60529 ED.2.2:2013, which highlights the dimensional coordination precision between the shells , to solve the tensile deformation cracking and inability to form for high tensile structures, break through the design limitations and have been mass-produced.
Details
Mobile phone composite cover, decorative parts, tablet computer, 3C and peripheral shell applications
Product Features: The 3.5D composite board has a high tensile structure, which better matches the front shell and the 3D curved screen to maximize the utilization rate of each other; it has the IP68 waterproof level defined in IEC60529 ED.2.2:2013, which highlights the dimensional coordination precision between the shells , to solve the tensile deformation cracking and inability to form for high tensile structures, break through the design limitations and have been mass-produced.
